2018.02.06 Electroplating Engineers of Japan Ltd. (EEJA) has become a wholly owned subsidiary of Tanaka Kikinzoku Kogyo K.K.
This is to announce that Tanaka Kikinzoku Kogyo K.K. has acquired all 50% of shares in Electroplating Engineers of Japan Ltd. (EEJA)—which carries out the electroplating business of the Tanaka Kikinzoku Group—previously owned by Alent Holdings B.V., making EEJA a wholly owned subsidiary of Tanaka Kikinzoku Kogyo K.K.
2017.11.28 Information about the exhibit. [NEPCON JAPAN 2018]
We will have an exhibition at Tokyo Big Sight.
2017.05.31 EEJA develops Innovative Direct Patterning Plating Technology that opens the potential of new-generation electronics.
At JPCA show 2017 from June 7 to 9 at Tokyo Big Sight, EEJA will introduce the new technology at booth located in the 7th hall 7B-37, and make NPI presentation for more detail on Thursday June 8, 14:50-15:20 at 7H-NPI Presentation site II.
2017.05.19 EEJA's new technology won the JPCA award 2017.
"New Direct Patterning Plating Technology which opened up possibility of the new generation electronics" is awarded the prize of JPCA show 2017 from June 7 to 9. EEJA will make a presentation on the new technology, 14:50-15:20, Thursday June 8, at NPI Presentation site II. We are looking forward to your visit.
2017.05.11 EEJA will participate in NPI (New Product Introduction) presentation at JPCA Show 2017.
NPI presentation on "Direct pattern plating of non-conductive material, which replaces vacuum process and metal ink process" will be delivered on June 8, 14:50 to 15:20, at 7H-NPI Presentation site II.
2017.05.11 Information about the exhibit. [JPCA Show 2017]
We are looking forward to your visit at EEJA's booth 7B-37 in the 7th hall Tokyo Big Sight from June 7-9 in 2017
2015.10.23 Information about the exhibit. [NEPCON JAPAN 2016]
We will have an exhibition at Tokyo Big Sight.
2015.10.01 Tanaka Precious Metals Establishes TANAKA America in Silicon Valley as Base for Global Strategy
We placed news release.
2015.09.10 Electroplating Engineers of Japan Establishes Local Subsidiary in Shanghai.
We placed news release.
2015.07.15 Electroplating Engineers of Japan Launches Semicondutor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass Production Machines.
We placed news release.
2015.06.30 Information about the exhibit. [SEMICON West2015]
We will have an exhibition at Moscone Center.
2015.03.11 the World's First Successful Development of Technology for the Simultaneous Formation of Contact Electrodes for p-Type and N-Type Organic Semiconductor Crystals Using the Plating Method.
We placed news release.
2014.09.26 Information about the exhibit. [NEPCON JAPAN 2015]
We will have an exhibition at Tokyo Big Sight.
2014.06.02 Information about the exhibit. [SEMICON West2014]
We will have an exhibition at Moscone Center.
2014.03.26 Information about the exhibit. [JPCA Show 2014]
We will have an exhibition at Tokyo Big Sight.
2014.03.04 Enthone Opens Wafer Level Packaging Applications Laboratory.(Enthone/EEJA America Inc.)
We placed news release.