EEJA, a leading supplier of coatings and electroplating products.
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We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer low-cost and highly productive plating processes with plating characteristics appropriate for their intended use.
Gold electroplating
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The superior bondability, heat resistance, and solderability of this series make them ideal for semiconductor components. Excellent thickness uniformity at a low gold concentration, enabling reduced Au consumption.
TEMPEREX series -
Gold electroplating process for wafer bumps. This series has excellent thickness uniformity, enabling plating with a high current density and low operation temperatures. GALVANOMEISTER GB series -
Non-cyanide Au plating for wafers. This series provides excellent properties for bump and fine pattern formation. MICROFAB Au series
| Process name | Application | Features |
|---|---|---|
| TEMPEREX 8400 | Bonding pad areas | Good uniform electrodeposition, neutral cyanide |
| TEMPEREX MLA300 | Low gold concentration, Ni elution prevention, neutral cyanide | |
| GALVANOMEISTER GB3 | Wafers (bump) | Low operation temperature, neutral cyanide |
| MICROFAB Au310 | Wafers (wiring) | Very fine surface roughness, neutral non-cyanide |
| MICROFAB Au660 | Wafers(bump) | Low hardness, high-speed, neutral non-cyanide |
| MICROFAB Au3151 | High hardness, high-speed, neutral non-cyanide |
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Excellent electrical properties, abrasion resistance, corrosion resistance, and solderability. This series is suitable for connectors and other electronic components. AUTRONEX series -
Non-cyanide gold-copper alloy process. High hardness deposits and excellent thickness uniformity. NEUTRONEX series -
Electrolytic gold-tin alloy process. This series allows easy adjustment of alloy ratios, making it possible to adjust them according to their melting temperatures. GALVANOMEISTER GT series -
Electrolytic gold-silver alloy process. This series has both the corrosion resistance of gold and reflectivity of silver, making them ideal for LED components. GALVANOMEISTER GS series
| Process name | Application | Features | |
|---|---|---|---|
| Au-Co | AUTRONEX GVC AUTRONEX ICC-7 |
Connectors, PWB | Acidity cyanide |
| Ni barrier property, Acidity cyanide | |||
| Au-Ni | AUTRONEX GVN AUTRONEX ICN100 |
Connectors, PWB | Acidity cyanide |
| Ni barrier property, Acidity cyanide | |||
| Au-Sn 20% | GALVANOMEISTER GT1000 | Alternative to coalescent | Acidity cyanide |
| Au-Ag 50% | GALVANOMEISTER GS3000 | Lead frames | Alkali cyanide |
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With "AUROBOND TCL" (Chlorine) and "XPH20" (Chlorine free), stainless steel can be plated directly in a strongly acid strike bath. AUROBOND series -
Non-cyanide type strike bath. NEUTRONEX Strike
| Process name | Application | Features |
|---|---|---|
| AUROBOND TN | General use | Acidity cyanide |
| AUROBOND XPH20 | SUS materials | Chlorine-free, Strong acidity cyanide |
| NEUTRONEX Strike | Wafer | Neutral non-cyanide |
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Excellent adhesion and solder wettability on electroless Ni plating. LECTROLESS Au series
"IG100" develops uniform film thickness on Pd film. -
Self-reduction type thick Pb-free electroless gold plating process. CERAGOLD series -
Non-cyanide electroless gold plating process applied to electrolytic and electroless Ni plating. PRECIOUSFAB IG series
| Process name | Application | Features |
|---|---|---|
| LECTROLESS Au1100S | Bonding pad areas | Immersion thin plating, cyanide |
| LECTROLESS FX-5 | Immersion thick plating, cyanide | |
| LECTROLESS IG100 | Uniform immersion thick Pd plating, cyanide | |
| LECTROLESS IGS2020 | Uniform immersion thick Pd plating, non-cyanide | |
| CERAGOLD 6060 | Ceramic components | Reduction thick plating, Pb-free, cyanide |
| PRECIOUSFAB IG7901 | Wafers (bonding pad areas) | Immersion thin plating, non-cyanide |
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"JS-5" exhibits semibright to bright surface and enables plating with a high current density. "5" exhibits very bright surface, making this series ideal for LED components. SILVREX series -
Non-cyanide process developed for wafer use PRECIOUSFAB Ag series
| Process name | Application | Features |
|---|---|---|
| SILVREX JS-5 | Lead frames | High-speed, cyanide |
| SILVREX 5 | General use | Brightening agent, cyanide |
| PRECIOUSFAB Ag4730 | Wafers | Non-cyanide |
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"LF-5" exhibits excellent corrosion resistance at high temperatures for Pd-PPF. The "AD series" is a work environment friendly process with less ammonia odor. PALLADEX series -
Platinum plating process that enables thick plating with low stress and crackless. PLATANEX series/PRECIOUSFAB Pt series -
Rhodium plating process that enables thick plating for industrial use. RHODEX
| Process name | Application | Features | |
|---|---|---|---|
| Pd | DECOREX | Decorative articles | White bright surface |
| PALLADEX LF-5 | Lead frames(Pd-PPF) | Thin-film high heat resistance | |
| PALLADEX ADG820 | Thin-film high heat resistance, Neutral | ||
| PALLADEX 82GV-E | Connectors | Pd-Ni 20% alloy | |
| PALLADEX PC200 | Pd-Co 20% alloy | ||
| MICROFAB Pd700 | Wafers (bump) | Neutral, thick plating | |
| Pt | PLATANEX 3LS | Electronic components | Acidity |
| PLATINART 100 | Electronic components | Electroless Pt | |
| Rh | RHODEX | High hardness | |
| SUPER RHODIUM 1000 | Electronic components, Decorative articles | Bright surface | |
| SUPER RHODIUM 2000 | White surface | ||
| Ru | RUTHENEX | Electronic components | High hardness |
| Ir | IRIDEX 300 | ||
