EEJA is providing the best plating solution in surface finishing technology

We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer low-cost and highly productive plating processes with plating characteristics appropriate for their intended use.

•  TEMPEREX series

  The superior bondability, heat resistance, and solderability of this series make them ideal for semiconductor components. Excellent thickness uniformity at a low gold concentration, enabling reduced Au consumption.

•  GALVANOMEISTER GB series

  Gold electroplating process for wafer bumps. This series has excellent thickness uniformity, enabling plating with a high current density and low operation temperatures.

•  MICROFAB Au series

  Non-cyanide Au plating for wafers. This series provides excellent properties for bump and fine pattern formation.

•  AUTRONEX series

  Excellent electrical properties, abrasion resistance, corrosion resistance, and solderability. This series is suitable for connectors and other electronic components.

•  NEUTRONEX series

  Non-cyanide gold-copper alloy process. High hardness deposits and excellent thickness uniformity.

•  GALVANOMEISTER GT series

  Electrolytic gold-tin alloy process. This series allows easy adjustment of alloy ratios, making it possible to adjust them according to their melting temperatures.

•  GALVANOMEISTER GS series

  Electrolytic gold-silver alloy process. This series has both the corrosion resistance of gold and reflectivity of silver, making them ideal for LED components.

•  AUROBOND series

  With "AUROBOND TCL" (Chlorine) and "XPH20" (Chlorine free), stainless steel can be plated directly in a strongly acid strike bath.

•  NEUTRONEX Strike

  Non-cyanide type strike bath.

•  LECTROLESS Au series

  Excellent adhesion and solder wettability on electroless Ni plating.
  "IG100" develops uniform film thickness on Pd film.

•  CERAGOLD series

  Self-reduction type thick Pb-free electroless gold plating process.

•  PRECIOUSFAB IG series

  Non-cyanide electroless gold plating process applied to electrolytic and electroless Ni plating.

•  SILVREX series

  "JS-5" exhibits semibright to bright surface and enables plating with a high current density. "5" exhibits very bright surface, making this series ideal for LED components.

•  PRECIOUSFAB Ag series

  Non-cyanide process developed for wafer use

•  PALLADEX series

  "LF-5" exhibits excellent corrosion resistance at high temperatures for Pd-PPF. The "AD series" is a work environment friendly process with less ammonia odor.

•  PLATANEX series/PRECIOUSFAB Pt series

  Platinum plating process that enables thick plating with low stress and crackless.

•  RHODEX

  Rhodium plating process that enables thick plating for industrial use.