EEJA, a leading supplier of coatings and electroplating products.

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HOME>Plating Chemical

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We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer low-cost and highly productive plating processes with plating characteristics appropriate for their intended use.

  •  Gold electroplating
  •  Gold alloy electroplating
  •  Gold strike plating
  •  Electroless gold plating
  •  Silver plating
  •  Platinum group

  •  TEMPEREX series

    The superior bondability, heat resistance, and solderability of this series make them ideal for semiconductor components. Excellent thickness uniformity at a low gold concentration, enabling reduced Au consumption.
  •  GALVANOMEISTER GB series

    Gold electroplating process for wafer bumps. This series has excellent thickness uniformity, enabling plating with a high current density and low operation temperatures.
  •  MICROFAB Au series

    Non-cyanide Au plating for wafers. This series provides excellent properties for bump and fine pattern formation.
Process name Application Features
TEMPEREX 8400 Bonding pad areas Good uniform electrodeposition, neutral cyanide
TEMPEREX MLA300 Low gold concentration, Ni elution prevention, neutral cyanide
GALVANOMEISTER GB3 Wafers (bump) Low operation temperature, neutral cyanide
MICROFAB Au310 Wafers (wiring) Very fine surface roughness, neutral non-cyanide
MICROFAB Au660 Wafers(bump) Low hardness, high-speed, neutral non-cyanide
MICROFAB Au3151 High hardness, high-speed, neutral non-cyanide

  •  AUTRONEX series

    Excellent electrical properties, abrasion resistance, corrosion resistance, and solderability. This series is suitable for connectors and other electronic components.
  •  NEUTRONEX series

    Non-cyanide gold-copper alloy process. High hardness deposits and excellent thickness uniformity.
  •  GALVANOMEISTER GT series

    Electrolytic gold-tin alloy process. This series allows easy adjustment of alloy ratios, making it possible to adjust them according to their melting temperatures.
  •  GALVANOMEISTER GS series

    Electrolytic gold-silver alloy process. This series has both the corrosion resistance of gold and reflectivity of silver, making them ideal for LED components.
Process name Application Features
Au-Co AUTRONEX GVC
AUTRONEX ICC-7
Connectors, PWB Acidity cyanide
Ni barrier property, Acidity cyanide
Au-Ni AUTRONEX GVN
AUTRONEX ICN100
Connectors, PWB Acidity cyanide
Ni barrier property, Acidity cyanide
Au-Sn 20% GALVANOMEISTER GT1000 Alternative to coalescent Acidity cyanide
Au-Ag 50% GALVANOMEISTER GS3000 Lead frames Alkali cyanide

  •  AUROBOND series

    With "AUROBOND TCL" (Chlorine) and "XPH20" (Chlorine free), stainless steel can be plated directly in a strongly acid strike bath.
  •  NEUTRONEX Strike

    Non-cyanide type strike bath.
Process name Application Features
AUROBOND TN General use Acidity cyanide
AUROBOND XPH20 SUS materials Chlorine-free, Strong acidity cyanide
NEUTRONEX Strike Wafer Neutral non-cyanide

  •  LECTROLESS Au series

    Excellent adhesion and solder wettability on electroless Ni plating.
    "IG100" develops uniform film thickness on Pd film.
  •  CERAGOLD series

    Self-reduction type thick Pb-free electroless gold plating process.
  •  PRECIOUSFAB IG series

    Non-cyanide electroless gold plating process applied to electrolytic and electroless Ni plating.
Process name Application Features
LECTROLESS Au1100S Bonding pad areas Immersion thin plating, cyanide
LECTROLESS FX-5 Immersion thick plating, cyanide
LECTROLESS IG100 Uniform immersion thick Pd plating, cyanide
LECTROLESS IGS2020 Uniform immersion thick Pd plating, non-cyanide
CERAGOLD 6060 Ceramic components Reduction thick plating, Pb-free, cyanide
PRECIOUSFAB IG7901 Wafers (bonding pad areas) Immersion thin plating, non-cyanide

  •  SILVREX series

    "JS-5" exhibits semibright to bright surface and enables plating with a high current density. "5" exhibits very bright surface, making this series ideal for LED components.
  •  PRECIOUSFAB Ag series

    Non-cyanide process developed for wafer use
Process name Application Features
SILVREX JS-5 Lead frames High-speed, cyanide
SILVREX 5 General use Brightening agent, cyanide
PRECIOUSFAB Ag4730 Wafers Non-cyanide

  •  PALLADEX series

    "LF-5" exhibits excellent corrosion resistance at high temperatures for Pd-PPF. The "AD series" is a work environment friendly process with less ammonia odor.
  •  PLATANEX series/PRECIOUSFAB Pt series

    Platinum plating process that enables thick plating with low stress and crackless.
  •  RHODEX

    Rhodium plating process that enables thick plating for industrial use.
Process name Application Features
Pd DECOREX Decorative articles White bright surface
PALLADEX LF-5 Lead frames(Pd-PPF) Thin-film high heat resistance
PALLADEX ADG820 Thin-film high heat resistance, Neutral
PALLADEX 82GV-E Connectors Pd-Ni 20% alloy
PALLADEX PC200 Pd-Co 20% alloy
MICROFAB Pd700 Wafers (bump) Neutral, thick plating
Pt PLATANEX 3LS Electronic components Acidity
PLATINART 100 Electronic components Electroless Pt
Rh RHODEX High hardness
SUPER RHODIUM 1000 Electronic components, Decorative articles Bright surface
SUPER RHODIUM 2000 White surface
Ru RUTHENEX Electronic components High hardness
Ir IRIDEX 300

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