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We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer low-cost and highly productive plating processes with plating characteristics appropriate for their intended use.
TEMPEREX series
GALVANOMEISTER GB series
MICROFAB Au series
Process name | Application | Features |
---|---|---|
TEMPEREX 8400 | Bonding pad areas | Good uniform electrodeposition, neutral cyanide |
TEMPEREX MLA300 | Low gold concentration, Ni elution prevention, neutral cyanide | |
GALVANOMEISTER GB3 | Wafers (bump) | Low operation temperature, neutral cyanide |
MICROFAB Au310 | Wafers (wiring) | Very fine surface roughness, neutral non-cyanide |
MICROFAB Au660 | Wafers(bump) | Low hardness, high-speed, neutral non-cyanide |
MICROFAB Au3151 | High hardness, high-speed, neutral non-cyanide |
AUTRONEX series
NEUTRONEX series
GALVANOMEISTER GT series
GALVANOMEISTER GS series
Process name | Application | Features | |
---|---|---|---|
Au-Co | AUTRONEX GVC AUTRONEX ICC-7 |
Connectors, PWB | Acidity cyanide |
Ni barrier property, Acidity cyanide | |||
Au-Ni | AUTRONEX GVN AUTRONEX ICN100 |
Connectors, PWB | Acidity cyanide |
Ni barrier property, Acidity cyanide | |||
Au-Sn 20% | GALVANOMEISTER GT1000 | Alternative to coalescent | Acidity cyanide |
Au-Ag 50% | GALVANOMEISTER GS3000 | Lead frames | Alkali cyanide |
AUROBOND series
NEUTRONEX Strike
Process name | Application | Features |
---|---|---|
AUROBOND TN | General use | Acidity cyanide |
AUROBOND XPH20 | SUS materials | Chlorine-free, Strong acidity cyanide |
NEUTRONEX Strike | Wafer | Neutral non-cyanide |
LECTROLESS Au series
CERAGOLD series
PRECIOUSFAB IG series
Process name | Application | Features |
---|---|---|
LECTROLESS Au1100S | Bonding pad areas | Immersion thin plating, cyanide |
LECTROLESS FX-5 | Immersion thick plating, cyanide | |
LECTROLESS IG100 | Uniform immersion thick Pd plating, cyanide | |
LECTROLESS IGS2020 | Uniform immersion thick Pd plating, non-cyanide | |
CERAGOLD 6060 | Ceramic components | Reduction thick plating, Pb-free, cyanide |
PRECIOUSFAB IG7901 | Wafers (bonding pad areas) | Immersion thin plating, non-cyanide |
SILVREX series
PRECIOUSFAB Ag series
Process name | Application | Features |
---|---|---|
SILVREX JS-5 | Lead frames | High-speed, cyanide |
SILVREX 5 | General use | Brightening agent, cyanide |
PRECIOUSFAB Ag4730 | Wafers | Non-cyanide |
PALLADEX series
PLATANEX series/PRECIOUSFAB Pt series
RHODEX
Process name | Application | Features | |
---|---|---|---|
Pd | DECOREX | Decorative articles | White bright surface |
PALLADEX LF-5 | Lead frames(Pd-PPF) | Thin-film high heat resistance | |
PALLADEX ADG820 | Thin-film high heat resistance, Neutral | ||
PALLADEX 82GV-E | Connectors | Pd-Ni 20% alloy | |
PALLADEX PC200 | Pd-Co 20% alloy | ||
MICROFAB Pd700 | Wafers (bump) | Neutral, thick plating | |
Pt | PLATANEX 3LS | Electronic components | Acidity |
PLATINART 100 | Electronic components | Electroless Pt | |
Rh | RHODEX | High hardness | |
SUPER RHODIUM 1000 | Electronic components, Decorative articles | Bright surface | |
SUPER RHODIUM 2000 | White surface | ||
Ru | RUTHENEX | Electronic components | High hardness |
Ir | IRIDEX 300 |