Japanese

Development
Product Development History

In addition to providing both plating chemicals and plating equipment to meet our customers' needs, we have evolved by integrating these capabilities into comprehensive solutions. Here, you can explore the history of our precious metal plating technologies and product development.

Chemical Development History

  • 1965

    Launched KARATCLAD series for decorative applications

    Launched AUTRONEX series gold plating process for printed circuit boards and terminals

    Launched TEMPEREX series gold plating process for electronic components

    Launched precious metal-containing products for all precious metal plating processes

  • 1966

    Launched BDT series non-cyanide gold plating process

  • 1972

    Launched TEMPEREX series cyanide electrolytic high speed gold plating process for lead frames

  • 1974

    Launched AUTRONEX CIMS for cyanide electrolytic high speed hard gold plating process

  • 1975

    Launched NEUTRONEX series non-cyanide gold plating process for LCD driver ICs

  • 1977

    Launched make-up solutions and replenishers

  • 1983

    Launched SILVREX JS series silver plating process for IC lead frames

  • 1987

    Launched ART FORM 18 gold electroforming process for decorative applications

  • 1988

    Launched TEMPEREX 8400 cyanide electrolytic gold plating process for ceramic IC packages (PGA)

  • 1991

    Launched MICROFAB Au series non-cyanide gold plating process for LCD driver ICs

  • 1993

    Launched PALLADEX LF series palladium plating process for IC lead frames (Pd-PPF)

  • 1998

    Launched MICROFAB Cu2000 series copper plating process for copper damascene applications

  • 2000

    Launched PRECIOUSFAB IG series non-cyanide immersion gold plating process

  • 2001

    Launched GALVANOMEISTER GB series cyanide gold plating process for wafers

  • 2002

    Launched PRECIOUSFAB Ag series non-cyanide silver plating process

  • 2005

    Launched GALVANOMEISTER GT series gold-tin alloy plating process

    Launched CERAGOLD 6070 low-thallium electroless cyanide-based reduction gold plating process

  • 2006

    Launched PALLADEX LF-5 ultra-thin palladium plating process for IC lead frames (Pd-PPF)

    Launched new MICROFAB Au series non-cyanide gold plating process for fine-pitch LCD driver ICs

  • 2007

    Launched AUTRONEX IC series nickel-barrier gold plating process for connectors

  • 2008

    Launched PALLADEX AD series neutral palladium plating process

    Launched PRECIOUSFAB ACG3000 non-cyanide electroless reduction gold plating process

  • 2009

    Launched IRIDEX CS1000 thick iridium alloy plating process

    Launched GALVANOMEISTER GS3000 gold-silver alloy plating process for LED lead frames

  • 2010

    Launched LECTROLESS IG100 thick-deposit immersion gold plating process on electroless palladium

  • 2011

    Launched PALLADEX PC200 palladium-cobalt alloy plating process

    Launched AUROBOND XPH20 halogen-free gold strike process for stainless steel

    Launched TEMPEREX MLA300 cyanide gold plating process inhibits gold displacement on Ni

  • 2012

    Launched TEMPEREX BHG100 hard pure gold plating process for bonding

    Launched PRECIOUSFAB IGS series non-cyanide immersion gold plating process for wafers

  • 2014

    Launched MICROFAB AuFL series non-cyanide thick flash gold plating process

    Launched LECTROLESS IGS2020 non-cyanide electroless immersion gold plating process for substrates

    Launched MICROFAB Pd750 neutral-type thick palladium plating process

  • 2015

    Launched MICROFAB EL series double zincate plating process for wafers

    Launched KARATCLAD AMD gold plating process for general decorative applications

    Launched MICROFAB In series indium plating process for wafers

  • 2016

    Launched MICROFAB GT series neutral non-cyanide gold-tin alloy plating process

    Launched MICROFAB Rh series thin rhodium plating process for wafers

    Launched GALVANOMEISTER GF series cyanide gold plating process for wafers

  • 2017

    Unveiled new SEADCAT direct patterning plating technology at JPCA Show 2017

    Launched SUPER RHODIUM 1100/2000 series high corrosion resistance rhodium plating process for electronic components and decorative applications

  • 2018

    Launched PALLADEX 82GV-LA palladium-nickel alloy plating process with reduced ammonia odor and internal stress

  • 2019

    Launched PRECIOUSFAB Rh200 ultra-high-hardness thick rhodium plating process

  • 2020

    Launched PRECIOUSFAB Pt2000 high corrosion resistance platinum plating process

  • 2021

    Launched PRECIOUSFAB Ag2000 high speed, high hardness, low cyanide silver plating process

  • 2022

    Launched PRECIOUSFAB HP3100 high hardness, high corrosion resistance platinum alloy plating process

    Launched AC FAB Ru200 electroless reduction ruthenium plating process

    Launched AC FAB Au-IAG1000 non-cyanide electroless reduction-assisted immersion thick gold plating process

    Launched PRECIOUSFAB Ag4700 non-cyanide matt silver plating process

  • 2023

    Launched MICROFAB Au5151 non-cyanide gold plating process for via filling

    Launched AC FAB Pt210 and Pt310 electroless reduction platinum plating process

  • 2024

    Launched AC MEISTER Au-1 electroless immersion reduction gold plating process

  • 2026

    Launched AC FAB ACG5000 high speed non-cyanide reduction gold plating process

Equipment Development History

  • 1965

    Launched MODULE-X rack and barrel manual plating equipment

  • 1967

    Imported and launched BETASCOPE coating thickness measurement equipment

  • 1970

    Launched MODULE-X rack and barrel automatic plating equipment

  • 1971

    Launched MODULE-MASQ manual selective plating equipment for short IC lead frames

  • 1973

    Launched COIL-TO-COIL automatic plating equipment for continuous strip material

  • 1974

    Launched MASQ-PWB high speed plating equipment for printed circuit board terminals

  • 1975

    Launched AUTO-MASQ automatic selective plating equipment for short IC lead frames

  • 1981

    Launched SPOT MATIC automatic plating equipment for short IC lead frames

  • 1986

    Launched AUROFINE potassium gold cyanide recovery equipment

  • 1987

    Imported and launched ART FORM gold electroforming equipment for decorative applications

  • 1988

    Launched SPECTAS3000 automatic inspection equipment for IC lead frames

  • 1989

    Launched SOLDER MATIC automatic solder plating equipment for IC lead frames

  • 1990

    Launched CUP-PLATER manual plating equipment for wafers

  • 1991

    Imported and launched XRF-5500 X-ray fluorescence thickness measurement equipment

  • 1992

    Launched POSFER200 automatic plating equipment for wafers

  • 1993

    Launched SBP brush plating equipment

  • 1995

    Imported and launched S-MODULE automatic high speed selective plating equipment for long IC lead frames

  • 1996

    Launched SPECTAS5000 automatic inspection equipment for IC lead frames

  • 1997

    Launched POSFER-C automatic plating equipment for wafers

  • 1998

    Launched CUSBIS automatic plating equipment for copper damascene wafers

  • 2001

    Launched POSFER300 automatic plating equipment for wafers

  • 2003

    Launched ALETA200 automatic plating equipment for wafers

  • 2005

    Launched ALETA300 automatic plating equipment for wafers

  • 2012

    Launched Stir CUP-PLATER manual plating equipment for wafers

  • 2013

    Launched POSFER-E automatic plating equipment for wafers

  • 2014

    Launched AUROFINE R2 impurity removal equipment

    Launched POSFER C-ST automatic plating equipment for wafers

  • 2015

    Launched RAD-Plater compact experimental plating equipment

  • 2019

    Integrated the plating equipment business into Mitomo Semicon Engineering Co., Ltd. (currently EEJA Technologies Ltd.)