Japanese

Plating Chemicals

Pre/Post Treatment Agents

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項目選択 Process Use Property Content Time Temp.
（℃）		 Features
EETOREX 12 Electro-degreasing Powder 25 - 100 g/L 1 - 3 min 25 - 60 Alkaline electro-cleaner
EETOREX 15 Acid Cleaning Liquid 200 - 500 mL/L 1 - 5 min 20 - 70 Acid cleaner, For general applications
EETOREX 15PF Acid Cleaning Liquid 20 - 50 mL/L 1 - 5 min 20 - 70 Acid cleaner
EETOREX AIG20 Copper Anti-immersion Liquid 10 - 100 mL/L 5 - 30 sec 20 - 70 Copper anti-immersion agent for direct gold plating on copper substrates
BUMPCLEANER DIP Activation for UBM Liquid 200 - 500 mL/L 1 - 5 min 20 - 70 Acidic Cleaner for wafer, For manual
BUMPCLEANER AUTO Activation for UBM Liquid 200 - 500 mL/L 1 - 5 min 20 - 70 Acidic Cleaner for wafer
IM FAB Pd-AC2 Pd Catalyst Activation Liquid Pd: 30 mg/L 3 - 11 min 20 - 30 For Pd catalyst, General applications
IM FAB Pd-AC6 Pd Catalyst Activation Liquid Pd: 30 mg/L 1 - 10 min 20 - 30 For Pd catalyst, Fine patterns
JS-WETTER Wetting agent Liquid 2 - 10 mL/L 1 - 10 sec 10 - 30 Wetting agent for maintaining wettability of substrates
SUPER DIP A 10T Silver Anti-Immersion Liquid 5 - 15 mL/L 5 - 30 sec 15 - 50 Silver anti-immersion agent
SUPER DIP F Silver Anti-Immersion Liquid 25 - 75 mL/L 5 - 30 sec 15 - 50 Silver anti-immersion agent
EETOREX 300 Anti-fungi Liquid 1 mL/L - 5 - 50 Anti-fungi agent for plating/recovery tanks
AF-2 Anti-fungi Liquid 15 - 25 mL/L - 15 - 60 Anti-fungi agent for plating/recovery tank

Stripper

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項目選択 Process Use Property Content Time Temp.
（℃）		 Features
HAKUREX GS T Au Liquid 100 - 300 mL/L 1 μm/ min 20 - 40 Cyanide gold stripper(KCN), High-speed,
Pb-free, Tl containing
EETOREX 62 Au Liquid 250 mL/L 1 μm/
3 min		 60 - 70 Cyanide gold stripper(NaCN), Mid-speed,
Metal-free
HAKUREX Au10 Au Powder/Liquid 130 g/L 1 μm/ min 40 - 60 Non-cyanide electrolytic gold stripper,
For connectors
HAKUREX Au20 Au Powder/Liquid 130 g/L 1 μm/ min 40 - 60 Non-cyanide electrolytic gold stripper,
For connectors, Prevents cloudiness
HAKUREX Ag06 Ag Powder 75 g/L 10 - 60 sec 25 - 50 Non-cyanide electrolytic silver stripper,
Matt/ semi-bright finish
HAKUREX Ag07 Ag Powder 75 g/L 10 - 60 sec 25 - 50 Non-cyanide electrolytic silver stripper,
Bright finish
HAKUREX CS Ag・Cu Powder 11.3 g/L 10 - 120 sec 20 - 40 Cyanide silver/copper stripper(KCN),
High-speed
HAKUREX Pd10 Pd Liquid 100 mL/L 0.5 - 3 min 15 - 40 Non-cyanide palladium stripper for Pd catalyst residue
MICROFAB 74 Cu Powder 80 - 120 g/L 1 - 3 min 20 - 30 Non-cyanide copper stripper
MICROFAB Au REMOVER Au Liquid Undiluted 1 μm/ min 40 - 60 Non-cyanide electrolytic gold stripper,
For wafers

Sealing Treatment and Antitarnish Agent

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項目選択 Process Use Property Content Time Temp.
（℃）		 Features
EETOREX SA Liquid 100 mL/L 5 - 20 sec 55 - 65 Sealing agent, Electrolytic type
EETOREX WS Liquid 35 - 65 mL/L 0.5 - 4 min 40 - 45 Sealing agent, Dip type
SILVERKEEPER Ag Liquid Undiluted 30 - 60 sec 25 - 30 Silver antitarnish agent, IPA-based
EETOREX 30 Ag Liquid 100 mL/L 10 - 120 sec 25 - 35 Etching agent for silver solder
EETOREX 70 Ag ・ Cu Liquid Undiluted 10 - 30 sec R.T. Silver/copper antitarnish agent
EETOREX 185 Cu Liquid 1.25 - 20 mL/L 5 - 30 sec 20 - 50 Copper, Copper alloy antitarnish agent, Water-soluble, For L/F
LED GUARD-S1 Ag Liquid 10 - 100 mL/L 10 sec＜ 20 - 50 Silver antitarnish agent
LED GUARD-100 Ag ・ Cu Liquid 40 - 250 mL/L 10 sec＜ 35 - 50 Silver/copper antitarnish agent

Plating Chemicals